Iimveliso
Industril isivamvo 4 umaleko engqongqo & flex pcb kunye nobhedu 2oz
| Iileya | 4 umaleko oqinileyo+2 umaleko oguqukayo |
| Ubukhulu bebhodi | 1.60MM + 0.2mm |
| Izinto eziphathekayo | FR4 tg150+Polymide |
| Ubunzima bobhedu | 1 OZ(35um) |
| Umphezulu Gqiba | ENIG Au Ukutyeba 1um;Ni Ukutyeba 3um |
| Umngxuma omncinci(mm) | 0.21mm |
| Ububanzi bomgca omncinci(mm) | 0.15mm |
| Isithuba somgca omncinci(mm) | 0.15mm |
| Solder Mask | Luhlaza |
| Umbala wentsomi | Mhlophe |
| Ukulungiswa koomatshini | V-amanqaku, CNC Milling(umzila) |
| Ukupakisha | Ingxowa ye-Anti-static |
| Uvavanyo lwe-E | Flying probe okanye Fixture |
| Umgangatho wokwamkelwa | IPC-A-600H Udidi 2 |
| Isicelo | Iimoto ze-elektroniki |
Intshayelelo
I-Rigid & flex pcbs idityaniswe neebhodi eziqinileyo ukwenza le mveliso ye-hybrid.Eminye imigangatho yenkqubo yokuvelisa ibandakanya isekethe eguquguqukayo ehamba ngeebhodi eziqinileyo, ezifana
uyilo lwesekethe ye-hardboard eqhelekileyo.
Umyili webhodi uya kongeza i-plad ngokusebenzisa imingxuma (PTHs) edibanisa iisekethe eziqinileyo kunye neziguquguqukayo njengenxalenye yale nkqubo.Le PCB yayidumile ngenxa yobukrelekrele bayo, ukuchaneka, kunye nokuguquguquka.
I-Rigid-Flex PCBs zenza lula uyilo lwe-elektroniki ngokususa iintambo ezibhetyebhetye, uqhagamshelo, kunye neengcingo zomntu ngamnye.IRigid & Flex iibhodi zokujikeleza zidityaniswe ngokuqinileyo kubume bebhodi iyonke, ephucula ukusebenza kombane.
Iinjineli zinokulindela ugcino olungcono kakhulu kunye nokusebenza kombane ngenxa yoqhagamshelo lwangaphakathi lwePCB yombane kunye noomatshini.
Izinto eziphathekayo
Izinto zeSubstrate
Eyona nto idumileyo yi-fiberglass elukiweyo.Umaleko oshinyeneyo we-epoxy resin unxibe le fiberglass.
Nangona kunjalo, i-epoxy-impregnated fiberglass ayiqinisekanga.Ayinakukwazi ukumelana nomothuko wequbuliso nozinzileyo.
Polyimide
Esi sixhobo sikhethwe ngenxa yokuguquguquka kwayo.Iqinile kwaye inokumelana nokothuka kunye nentshukumo.
I-Polyimide inokumelana nobushushu.Oku kuyenza ilungele izicelo ezinokuguquguquka kobushushu.
Ipolyester (PET)
I-PET ithandwa ngeempawu zayo zombane kunye nokuguquguquka.Ixhathisa iikhemikhali kunye nokufuma.Isenokuthi ke ngoko isetyenziswe kwiimeko ezinzima zoshishino.
Ukusebenzisa i-substrate efanelekileyo kuqinisekisa amandla afunwayo kunye nokuphila ixesha elide.Iqwalasela izinto ezifana nokumelana nobushushu kunye nokuzinza komlinganiselo ngelixa ukhetha i-substrate.
I-Polyimide Adhesives
Ubushushu be-elasticity yale nto yokuncamathelisa yenza ukuba ilungele umsebenzi.Iyakwazi ukumelana nama-500°C.Ukumelana nokushisa kwayo okuphezulu kwenza ukuba ifaneleke kwiintlobo ezahlukeneyo zezicelo ezibalulekileyo.
I-Polyester Adhesives
Ezi zincamathelisi zonga iindleko ngaphezu kokuncamatheliswa kwe-polyimide.
Zilungile ukwenza iisekethe ezisisiseko eziqinileyo zobungqina bokudubula.
Ulwalamano lwabo nalo lubuthathaka.Izinto zokuncamathelisa iPolyester nazo azikwazi ukumelana nobushushu.Ziye zahlaziywa kutshanje.Oku kubanika ukumelana nobushushu.Olu tshintsho lukwakhuthaza ukuziqhelanisa.Oku kubenza bakhuseleke kwindibano yePCB eninzi.
I-Acrylic Adhesives
Ezi zincamathelisi ziphezulu.Zinozinzo oluhle kakhulu lwe-thermal ngokuchasene ne-corrosion kunye neekhemikhali.Kulula ukuzisebenzisa kwaye azibizi kakhulu.Ngokudibanisa nokufumaneka kwazo, zithandwa phakathi kwabavelisi.abavelisi.
Ii-epoxies
Le yeyona nto isetyenziswa kakhulu kwi-rigid-flex circuit circuit.Ziyakwazi ukumelana nomhlwa kunye namaqondo obushushu aphezulu naphantsi.
Zikwayakwazi ukuziqhelanisa ngokugqithisileyo kwaye uzinzile.Inepolyester encinci kuyo eyenza ibe bhetyebhetye.
Iminxekile
I-stack-up ye-rigid-ex PCB yenye yezona ndawo zininzi ngexesha
eqinile-ex eyenziwe PCB kwaye intsonkothe ngakumbi kunomgangatho
iibhodi ezomeleleyo, makhe sijonge 4 umaleko we-rigid-ex PCB njengezantsi:
Imaski yesolder ephezulu
Umaleko ophezulu
I-Dielectric 1
Umaleko woMqondiso 1
I-Dielectric 3
Umaleko womqondiso 2
I-Dielectric 2
Umaleko ongezantsi
Imaski esezantsi
PCB Umthamo
| Umthamo webhodi engqongqo | |
| Inani leleya: | I-1-42 imigangatho |
| Izinto: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Umaleko ongaphandle ubukhulu be-Cu: | 1-6OZ |
| Umaleko wangaphakathi ubukhulu be-Cu: | 1-4OZ |
| Ubuninzi bomsebenzi wokulungisa: | 610*1100mm |
| Ubuncinci bobunzima bebhodi: | 2 umaleko 0.3mm (12mil) 4 umaleko 0.4mm (16mil) 6 umaleko 0.8mm (32mil) 8 umaleko 1.0mm (40mil) 10 umaleko 1.1mm (44mil) 12 umaleko 1.3mm (52mil) 14 umaleko 1.5mm (59mil) 16 umaleko 1.6mm (63mil) |
| Ubuncinci Ububanzi: | 0.076mm (3mil) |
| Ubuncinane besithuba: | 0.076mm (3mil) |
| Ubuncinane bobungakanani bomngxuma (umngxuma wokugqibela): | 0.2mm |
| Umgangatho wento: | 10:1 |
| Ubungakanani bomngxuma wokugrumba: | 0.2-0.65mm |
| Ukunyamezela ukugrumba: | +\-0.05mm(2mil) |
| Ukunyamezela kwe-PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
| Unyamezelo lwe-NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
| Gqibezela ukunyamezela ibhodi: | Ukutyeba＜0.8mm, Ukunyamezela:+/-0.08mm |
| 0.8mm≤Ukutyeba≤6.5mm,Ukunyamezela+/-10% | |
| Ubuncinci ibhulorho ye-soldermask: | 0.076mm (3mil) |
| Ukujija kunye nokugoba: | ≤0.75% Min0.5% |
| Uluhlu lwe-TG: | 130-215℃ |
| Unyamezelo lwe-impedance: | +/-10%, Min+/-5% |
| Unyango loMphezulu: | HASL, LF HASL |
| Ukuntywiliselwa kweGolide, iFlash Gold, umnwe weGolide | |
| ISilivere yokuntywiliselwa, iTin yokuntywiliselwa, i-OSP | |
| Ukucwenga kweGolide okukhethiweyo, ubukhulu begolide ukuya kuthi ga kwi-3um (120u) | |
| Ushicilelo lweKhabhoni, oluPeelable S/M,ENEPIG | |
| Umthamo webhodi yeAluminiyam | |
| Inani leleya: | Umaleko omnye, iileya ezimbini |
| Obona bukhulu bobungakanani bebhodi: | 1500*600mm |
| Ubukhulu bebhodi: | 0.5-3.0mm |
| Ubunzima bobhedu: | 0.5-4oz |
| Ubuncinane bobungakanani bomngxuma: | 0.8mm |
| Ubuncinci ububanzi: | 0.1mm |
| Ubuncinci besithuba: | 0.12mm |
| Ubuncinci besayizi yephedi: | 10 micron |
| Ukugqitywa komphezulu: | HASL,OSP,ENIG |
| Ukubunjwa: | I-CNC, i-Punching, i-V-cut |
| Izixhobo: | Universal Tester |
| Flying Probe Open/Mfutshane Tester | |
| Amandla aphezulu ngeMicroscope | |
| I-Solderability Testing Kit | |
| Umvavanyi we-Peel Amandla | |
| IVolt ePhezulu evulekileyo kunye nomvavanyi omfutshane | |
| IKhiti yokuBumba yeCandelo lokuNgqogqa NgePolisher | |
| Ubuchule beFPC | |
| Iileya: | I-1-8 imigangatho |
| Ubukhulu bebhodi: | 0.05-0.5mm |
| Ubunzima bobhedu: | 0.5-3OZ |
| Ubuncinci Ububanzi: | 0.075mm |
| Ubuncinci besithuba: | 0.075mm |
| Ngaphakathi komngxuma ubukhulu: | 0.2mm |
| Ubuncinci bobungakanani bomngxuma welaser: | 0.075mm |
| Ubuncinane bobungakanani bomngxuma wokugqobhoza: | 0.5mm |
| Ukunyamezela kwe-Soldermask: | +\-0.5mm |
| Ubuncinci bokunyamezela idimension dimension: | +\-0.5mm |
| Ukugqitywa komphezulu: | I-HASL, iLF HASL, iSilivere yokuntywiliselwa, iGolide yokuntywiliselwa, iFlash Gold, i-OSP |
| Ukubunjwa: | Ukubetha, iLaser, ukusika |
| Izixhobo: | Universal Tester |
| Flying Probe Open/Mfutshane Tester | |
| Amandla aphezulu ngeMicroscope | |
| I-Solderability Testing Kit | |
| Umvavanyi we-Peel Amandla | |
| IVolt ePhezulu evulekileyo kunye nomvavanyi omfutshane | |
| IKhiti yokuBumba yeCandelo lokuNgqogqa NgePolisher | |
| Umthamo oqinileyo & oguqukayo | |
| Iileya: | I-1-28 imigangatho |
| Uhlobo lwezinto: | FR-4(High Tg, Halogen Free, High Frequency) PTFE, BT, Getek, Aluminium base,Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Ubukhulu bebhodi: | 6-240mil / 0.15-6.0mm |
| Ubunzima bobhedu: | 210um (6oz) umaleko wangaphakathi 210um (6oz) umaleko wangaphandle |
| Ubuncinci bobungakanani bomatshini bomatshini: | 0.2mm/0.08” |
| Umgangatho wento: | 2:1 |
| Ubungakanani bobukhulu bephaneli: | Icala elinye okanye amacala amabini: 500mm * 1200mm |
| Iileya ezininzi:508mm X 610mm (20″ X 24″) | |
| Ububanzi bomgca obuncinci/isithuba: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Ngohlobo lomngxuma: | Iimfama / zangcwatywa / ziPlug(VOP,VIP…) |
| HDI / Microvia: | EWE |
| Ukugqitywa komphezulu: | HASL, LF HASL |
| Ukuntywiliselwa kweGolide, iFlash Gold, umnwe weGolide | |
| ISilivere yokuntywiliselwa, iTin yokuntywiliselwa, i-OSP | |
| Ukucwenga kweGolide okukhethiweyo, ubukhulu begolide ukuya kuthi ga kwi-3um (120u) | |
| Ushicilelo lweKhabhoni, oluPeelable S/M,ENEPIG | |
| Ukubunjwa: | I-CNC, i-Punching, i-V-cut |
| Izixhobo: | Universal Tester |
| Flying Probe Open/Mfutshane Tester | |
| Amandla aphezulu ngeMicroscope | |
| I-Solderability Testing Kit | |
| Umvavanyi we-Peel Amandla | |
| IVolt ePhezulu evulekileyo kunye nomvavanyi omfutshane | |
| IKhiti yokuBumba yeCandelo lokuNgqogqa NgePolisher | |
