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PCB Fabrication Overview

Kwi-ANKE PCB, iinkonzo ze-PCB eziqhelekileyo zibhekiselele kwiinkonzo zokuvelisa ibhodi yesekethe egcweleyo.Ngaphezu kweminyaka eyi-10 PCB amava okuvelisas, siye saphatha amawaka eeprojekthi ze-PCB ezigubungela phantse lonke uhlobo lwemathiriyeli ephantsi kuquka i-FR4, iAluminiyam, iRogers nokunye.Eli phepha libhekisa kuphela kwi-FR4 esekwe kwi-PCBs.Kwii-PCB ezineenxalenye ezikhethekileyo zobugcisa, nceda ubhekisele kumaphepha ewebhu ahambelanayo ngolwazi okanye uzive ukhululekile ukusibhalelainfo@anke-pcb.com.

Eyahlukileyo pcb isampulu, umgangatho PCB uye tolerances ngqongqo imveliso kunye nomgangatho imveliso ezinzile.

Iinkonzo ezisemgangathweni zePCB ziyacetyiswa xa uyilo lwakho lulungele ukutshintsha ukusuka kwiprototype ukuya kwimveliso.Sinokuvelisa ukuya kuthi ga kwi-10 yezigidi zePCB ezikumgangatho ophezulu ngeentsuku nje ezi-2.Ukunika iprojekthi yakho ukusebenza okufunayo kunye nezinto ezinokwenzeka ngakumbi, sinikezela ngeempawu eziphambili kwiinkonzo ezisemgangathweni zePCB.Isakhono esibanzi siboniswa ngolu hlobo lungezantsi:

Isakhono esiBanzi

Uphawu

 Ukubanakho

IBanga elisemgangathweni

IPC esemgangathweni 2

Inani leMaleko

1 -4Iileya ezi-2

Order Quantity

1pc - 10,000,000 iipcs

Ixesha lokukhokhela

1 usuku-iiveki ezi-5 (Inkonzo eKhawuliweyo)

Izinto eziphathekayo

FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg180°C,FR4-Halogen-free, FR4-Halogen-free & High-Tg

Ubungakanani beBhodi

610*1100mm

Ukunyamezela ubungakanani bebhodi

± 0.1mm - ± 0.3mm

Ukutyeba kweBhodi

0.2-0.65mm

Ukunyamezela ukutyeba kweBhodi

±0.1mm - ±10%

Ubunzima bobhedu

1-6OZ

I-Inner Layer Copper Weight

1-4OZ

Ukunyamezelana nokutyeba kobhedu

+0μm +20μm

Min Ukulandela / Isithuba

3mil/3mil

Amacala eMaski eSolder

Ngokwefayile

Umbala weMaski yeSolder

Buhlaza, Mhlophe, Buso, Mnyama, Bubomvu, Mthubi

Silkscreen Amacala

Ngokwefayile

Umbala weSilkscreen

Mhlophe, Bhulowu, Mnyama, Obomvu, Mthubi

Umphezulu Gqiba

I-HASL - Umgangatho weSolder yoMoya oshushu

Khokela iHASL yasimahla - RoHS

ENIG-Electroless Nickle/Immersion Gold-RoHS

ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold-RoHS

Ukuntywiliselwa kwiSilivere - RoHS

Ukuntywiliselwa kwiTin-RoHS

OSP -Organic Solderability Preservatives - RoHS

Ukucwenga kweGolide okukhethiweyo, ubukhulu beGolide ukuya kuthi ga kwi-3um (120u)

Min Annular Ring

3mil

Min Drilling Hole Diameter

6mil, 4mil-laser drill

Ububanzi obuncinci bokusika (NPTH)

Ububanzi obuncinci bokusika (NPTH)

NPTH Ukunyamezela ubungakanani boMngxuma

±.002" (±0.05mm)

Ububanzi obuncinci boMngxuma wokuSibeka (PTH)

0.6mm

Unyamezelo lobungakanani boMngxuma we-PTH

±.003" (±0.08mm) - ±4mil

Umphezulu/Umngxunya wokuPlatha Ukutyeba

20μm - 30μm

Ukunyamezela kweSM (LPI)

0.003" (0.075mm)

Umgangatho wento

1.10 (ubungakanani bomngxuma: ubukhulu bebhodi)

Uvavanyo

I-10V - 250V, i-flying probe okanye isixhobo sokuvavanya

Ukunyamezela kokunyamezela

±5% - ±10%

Ixabiso le-SMD

0.2mm(8mil)

I-BGA Pitch

0.2mm(8mil)

Chamfer of Gold Fingers

20, 30, 45, 60

Ezinye iindlela

Iminwe yegolide

Iimfama kunye neMingxunya Engcwatywayo

imaski yesolder e peelable

Ukubekwa komphetho

Imaski yeCarbon

Kapton tape

I-counterbore umngxuma

Umngxuma owenziwe ngesiqingatha / owenziwe ngeCastellated

Cinezela umngxuma wokungena

Ngeentente / egqunywe ngeresin

Ngeplagi eplagiweyo/ezaliswe ngeresin

Nge pad

Uvavanyo loMbane