PCB Izixhobo zeNdibano
I-ANKE PCB ibonelela ngokhetho olukhulu lwezixhobo ze-SMT eziquka ii-oveni ezisetyenziswayo, ezizihambelayo kunye nezizenzekela ngokuzeleyo, ukukhetha & ukubeka oomatshini kunye nebhetshi yebhentshi kunye nee-oveni ezisezantsi zokuqukuqela ezisezantsi ukuya kumbindi womthamo wokuhlangana komphezulu wokunyuka.
Kwi-ANKE PCB siqonda ngokupheleleyo umgangatho yinjongo ephambili yendibano ye-PCB kwaye ikwazi ukuphumeza indawo ye-state-of-art ethobela i-PCB yamva nje yokwenziwa kunye nezixhobo zokuhlanganisa.
Umlayishi wePCB ozenzekelayo
Lo matshini uvumela iibhodi ze-pcb ukuba zondle kumatshini wokushicilela we-solder ozenzekelayo.
Inzuzo
• Ukonga ixesha labasebenzi
• Ukugcinwa kweendleko kwimveliso yendibano
• Ukunciphisa impazamo enokuthi ibangelwe yincwadana
Umshicileli weStencil ozenzekelayo
I-ANKE inezixhobo zangaphambili ezifana noomatshini bokuprinta bestencil abazenzekelayo.
• Iyacwangciswa
• Inkqubo ye-squeegee
• Inkqubo yokumisa ezenzekelayo yestencil
• Inkqubo yokucoca ezimeleyo
• Udluliselo lwe-PCB kunye nenkqubo yendawo
• Ujongano olusebenzisekayo olulula lwesiNgesi/isiTshayina
• Inkqubo yokubamba imifanekiso
• Ukuhlolwa kwe-2D & SPC
• Ulungelelwaniso lwestensile yeCCD
SMT Khetha & Beka oomatshini
• Ukuchaneka okuphezulu kunye nokuguquguquka okuphezulu kwe-01005, 0201, SOIC, PLCC, BGA, MBGA, CSP, QFP, ukuya kuthi ga kwi-fine-pitch 0.3mm
• Isixokelelwano sothungelwano lwe-encoder esingaqhagamshelwanga ukuze siphindaphindeke kwaye uzinzo
• Inkqubo ye-Smart feeder ibonelela ngokujonga indawo yokutya okuzenzekelayo, ukubala icandelo elizenzekelayo, ukulandelwa kwedatha yemveliso
• Inkqubo yolungelelwaniso yeCOGNEX "Umbono kwiFly"
• Inkqubo yolungelelwaniso lombono osezantsi yepitch entle QFP & BGA
• Igqibelele kwimveliso yomthamo omncinci & ophakathi
• Isixokelelwano sekhamera eyakhelweyo nge-auto smart fiducial mark learning
• Inkqubo yokukhupha
• Ukuhlolwa kombono phambi nasemva kwemveliso
• Uguqulo lweCAD jikelele
• Izinga lokubeka: 10,500 cph (IPC 9850)
• Iinkqubo zokujija ibhola kwi-X- kunye ne-Y-axes
• Ilungele i-160 i-auto tape feeder ekrelekrele
I-Oveni yokuBonelela engaMahla yaMahla/I-Oveni yokuBonisa eNgaMahla yaMahla
•Isoftware yeWindows XP enezinye iindlela zesiTshayina nesiNgesi.Yonke inkqubo phantsi
ulawulo lokudibanisa lunokuhlalutya kwaye lubonise ukusilela.Yonke idatha yokuvelisa ingagcinwa ngokupheleleyo kwaye ihlalutywe.
• Iyunithi yokulawula yePC&Siemens PLC enomsebenzi ozinzileyo;Ukuchaneka okuphezulu kokuphindwa kweprofayile kunokunqanda ilahleko yemveliso ebalelwa kukusebenza okungaqhelekanga kwekhompyuter.
• Uyilo olukhethekileyo lwe-thermal convection yeendawo zokufudumeza ukusuka kumacala angama-4 lubonelela ngokusebenza kakuhle kobushushu;umahluko wobushushu obuphezulu phakathi kweendawo ezidibeneyo ezi-2 zinokuphepha ukuphazamiseka kobushushu;Inokunciphisa umahluko weqondo lobushushu phakathi kobukhulu obukhulu kunye nezinto ezincinci kwaye ihlangabezane nemfuno yokuthengisela yePCB enzima.
• Ukupholisa umoya okunyanzelweyo okanye isibandisi sokupholisa samanzi esinesantya sokupholisa esisebenzayo sifanelana neentlobo ezahlukeneyo zentlama yokuthambisa ilothe yasimahla.
• Ukusetyenziswa kwamandla aphantsi (8-10 KWH/yure) ukugcina iindleko zokwenziwa.
I-AOI (iNkqubo yoHlolo oluSebenzayo)
I-AOI sisixhobo esibona iziphene eziqhelekileyo kwimveliso ye-welding ngokusekelwe kwimigaqo ye-optical.I-AOl iteknoloji yokuvavanya evelayo, kodwa ikhula ngokukhawuleza, kwaye abaninzi abavelisi baye baqalisa izixhobo zokuvavanya i-Al.
Ngethuba lokuhlola ngokuzenzekelayo, umatshini uhlola ngokuzenzekelayo i-PCBA ngekhamera, uqokelela imifanekiso, kwaye uqhathanise i-solder efunyenweyo kunye neeparitha ezifanelekileyo kwi-database.Ukulungisa umlungisi.
I-high-speed, iteknoloji yokulungiswa kombono ophezulu isetyenziselwa ukukhangela ngokuzenzekelayo iimpazamo ezahlukeneyo zokubeka kunye neziphene ze-solder kwibhodi ye-PB.
Iibhodi zePC zivela kwi-fine-pitch high-density boards to low-density big size boards, ukubonelela ngezisombululo zokuhlola kwi-line ukuphucula ukusebenza kwemveliso kunye nomgangatho we-solder.
Ngokusebenzisa i-AOl njengesixhobo sokunciphisa isiphene, iimpazamo zinokufunyanwa kwaye zipheliswe ekuqaleni kwenkqubo yokuhlanganisana, okubangelwa kulawulo lwenkqubo elungileyo.Ukufunyaniswa kwangethuba kweziphene kuya kuthintela iibhodi ezimbi ukuba zingathunyelwa kumanqanaba endibano alandelayo.I-AI iya kunciphisa iindleko zokulungisa kwaye igweme ukuchithwa kweebhodi ngaphandle kokulungiswa.
3D X-Ray
Ngophuhliso olukhawulezayo lwetekhnoloji ye-elektroniki, ukupakishwa kwe-miniaturization encinci, indibano yoxinaniso oluphezulu, kunye nokuvela okuqhubekayo kobugcisa obutsha bokupakisha obuhlukeneyo, iimfuno zomgangatho wendibano yesiphaluka ziya zinyuka ngokunyuka.
Ngoko ke, iimfuno eziphezulu zibekwe kwiindlela zokubona kunye nobuchwepheshe.
Ukuze kuhlangatyezwane nale mfuneko, ubugcisa obutsha bokuhlola buhlala buvela, kwaye iteknoloji yokuhlola i-X-ray ye-3D ngummeli oqhelekileyo.
Ayinakubona kuphela i-solder engabonakaliyo, njenge-BGA (i-Ball Grid Array, i-ball grid array package), njl.
Okwangoku, kusetyenziswa iindlela ezininzi ezahlukeneyo zovavanyo kwicandelo lovavanyo lwendibano ye-elektroniki.
Ngokuqhelekileyo izixhobo luhlolo olubonakalayo lweManuwali (MVI), umvavanyi wesekethe (ICT), kunye ne-Automatic Optical.
Ukuhlola (Ukuhlola okuzenzekelayo okuSebenzayo).I-AI), Ukuhlolwa kwe-X-ray ngokuzenzekelayo (i-AXI), i-Functional Tester (FT) njl.
PCBA Rework Station
Ngokubhekiselele kwinkqubo yokuhlaziya yonke indibano ye-SMT, inokwahlulwa ibe ngamanyathelo amaninzi afana ne-desoldering, i-component reshaping, i-PCB pad yokucoca, ukubekwa kwecandelo, i-welding, kunye nokucoca.
1. I-Desoldering: Le nkqubo kukususa amacandelo alungisiweyo kwi-PB yamacandelo e-SMT asisigxina.Owona mgaqo usisiseko asikokonakalisi okanye ukonakalisa amacandelo asusiweyo ngokwawo, amacandelo ajikelezileyo kunye neepads zePCB.
2. Ukubunjwa kwecandelo: Emva kokuba amacandelo asetyenzisiweyo achithwa, ukuba ufuna ukuqhubeka nokusebenzisa amacandelo asusiweyo, kufuneka uhlaziye amacandelo.
3. Ukucoca i-PCB pad: Ukucoca i-PCB pad kubandakanya ukucocwa kweephedi kunye nomsebenzi wokulungelelanisa.Umgangatho wePad udla ngokubhekisa ekuphakameni komphezulu we-PCB wesixhobo esisusiweyo.Ukucoca i-pad ngokuqhelekileyo kusebenzisa i-solder.Isixhobo sokucoca, esifana nentsimbi ye-soldering, sisusa i-solder eseleyo kwi-pads, emva koko isula nge-alcohol epheleleyo okanye i-solvent evunyiweyo yokususa iifayini kunye ne-residual flux components.
4. Ukubekwa kwamacandelo: khangela i-PCB esetyenzisiweyo ngokutsha kunye ne-solder paste eprintiweyo;sebenzisa isixhobo sokubekwa kwecandelo lesikhululo sokuphinda sisetyenziselwe ukukhetha ivacuum nozzle efanelekileyo kwaye ulungise iPCB yokuphinda ibekwe.
5. I-Soldering: Inkqubo ye-soldering ye-rework inokwahlulwa ngokusisiseko kwi-soldering manual kunye ne-reflow soldering.Ifuna ukuqwalaselwa ngononophelo ngokusekelwe kumacandelo kunye neempawu ze-PB zokubeka, kunye neempawu ze-welding material ezisetyenzisiweyo.I-welding manual ilula kwaye isetyenziselwa ukuwelda ngokutsha kwamacandelo amancinci.
Umatshini wokuSoldera wamaza oKhokelo
• Isikrini sokuchukumisa + iyunithi yokulawula ye-PLC, umsebenzi olula nothembekileyo.
• Uyilo olulungelelanisiweyo lwangaphandle, uyilo lwemodyuli yangaphakathi, hayi nje entle kodwa kulula ukuyigcina.
• Isitshizi esiphumayo sivelisa iatomization elungileyo ngokusetyenziswa kweflux ephantsi.
• Umbhobho wefeni ye-Turbo enekhethini ekhuselayo ukuthintela ukusasazwa kwe-atomized flux kwindawo yokufudumeza kwangaphambili, ukuqinisekisa ukusebenza ngokukhuselekileyo.
• I-modularized heater preheating ilungele ukulungiswa;I-PID yokulawula ukufudumeza, ubushushu obuzinzile, ijika eligudileyo, ukusombulula ubunzima benkqubo yokukhokela.
• Iipani ze-solder ezisebenzisa amandla aphezulu, intsimbi etyhidiweyo engaguqukiyo ivelisa ukusebenza kakuhle kwe-thermal.
Imilomo eyenziwe nge-titanium iqinisekisa ukuguqulwa kwe-thermal ephantsi kunye ne-oxidation ephantsi.
• Inomsebenzi wokuqalisa okuzenzekelayo okubekelwe ixesha kunye nokuvalwa kwawo wonke umatshini.
