Itekhnoloji yeTHT
Itekhnoloji ye-Thru-hole, ekwabizwa ngokuba “nge-through-hole”, ibhekisa kwisikimu sokunyuswa esisetyenziselwa amacandelo e-elektroniki abandakanya ukusetyenziswa kwesikhokelo kumacandelo afakwe kwimingxunya egrunjiweyo kwiibhodi zesekethe eziprintiweyo (PCB) zaza zathengiswa kwiipads icala elichaseneyo nokuba kukudityaniswa kwezandla/ukusoda ngesandla okanye ngokusetyenziswa komatshini wokuxhoma owenziweyo.
Ngabasebenzi abangaphezulu kwama-80 abaqeqeshiweyo be-IPC-A-610 abadityaniswe ngesandla kunye nokuthengiswa ngesandla kwamacandelo, siyakwazi ukubonelela ngeemveliso ezisemgangathweni ophezulu ngexesha elifunekayo.
Ngazo zombini i-lead kunye ne-lead i-solder yamahhala asinayo-i-clean, i-solvent, i-ultrasonic kunye neenkqubo zokucoca ezinamanzi ezikhoyo.Ukongeza ekuboneleleni ngazo zonke iintlobo zokudityaniswa komngxuma-mngxunya, i-Conformal coating inokufumaneka ukuze igqitywe imveliso.
Xa kusenziwa iprototyping, iinjineli zoyilo zihlala zikhetha ukuba mikhulu kwimingxunya ukuya kwindawo yokubeka umphezulu kuba zinokusetyenziswa ngokulula kunye neesokethi zebhodi yesonka.Nangona kunjalo, i-high-speed okanye i-high-frequency designs inokufuna iteknoloji ye-SMT ukunciphisa i-inductance elahlekileyo kunye ne-capacitance kwiingcingo, ezinokuthi ziphazamise ukusebenza kwesekethe.Nakwinqanaba leprototype yoyilo, uyilo lwe-ultra-compact lunokuyalela ulwakhiwo lwe-SMT.
Ukuba kukho naluphi na ulwazi olunomdla pls zive ukhululekile ukuqhagamshelana nathi.
