I-Surface Mount Technology (SMT): Itekhnoloji yokucubungula iibhodi zePCB ezingenanto kunye nokunyuswa kwezixhobo ze-elektroniki kwibhodi yePCB.Le yeyona teknoloji idumileyo yokusetyenzwa kwe-elektroniki kule mihla enamalungu e-elektroniki aya esiba mancinci kunye nomkhwa wokuthatha indawo kancinane kwi-DIP plug-in technology.Zombini itekhnoloji ingasetyenziswa kwibhodi enye, kunye netekhnoloji yethru-hole esetyenziselwa amacandelo angafanelanga ukunyuswa komphezulu njengeenguqu ezinkulu kunye ne-semiconductors yamandla atshiswe ngubushushu.
Icandelo le-SMT lidla ngokuba lincinci kuneqabane lalo le-thru-hole kuba inokhokelo oluncinane okanye akukho konke konke.Isenokuba nezikhonkwane ezimfutshane okanye izikhokelo zeendlela ezahlukeneyo, unxibelelwano olucaba, i-matrix yeebhola ze-solder (BGAs), okanye ukupheliswa kumzimba wecandelo.
Imiboniso eyodwa:
> Isantya esiphezulu sokuchola kunye nomatshini wokubeka yonke into encinci, ephakathi ukuya kwindibano enkulu ye-SMT (SMTA).
> Ukuhlolwa kweX-ray kwiNdibano yeSMT ekumgangatho ophezulu (SMTA)
>Umgca wendibano ubeka ukuchaneka +/- 0.03 mm
>Phatha iipaneli ezinkulu ukuya kuthi ga kwi-774 (L) x 710 (W) mm ngobukhulu
>Bamba ubungakanani bamacandelo ukuya kwi-74 x 74, Ubude ukuya kuma-38.1 mm ngobukhulu
> I-PQF yokuchola kunye nomatshini wendawo isinika ukuguquguquka okungaphezulu kokuqhuba okuncinci kunye nokwakhiwa kwebhodi yeprototype.
>Yonke indibano ye-PCB (PCBA) ilandelwa ngumgangatho we-IPC 610 weklasi II.
> Umatshini wokukhetha nokubeka iSurface Mount Technology (SMT) usinika amandla okusebenza kwiphakheji yecandelo leSurface Mount Technology (SMT) elincinane kuno-01 005 elilingana ne-1/4 yecandelo le-0201.
