Ngotshintsho olukhawulezayo lobomi bangoku obufuna iinkqubo ezininzi ezongezelelweyo ezinokuthi ziphucule ukusebenza kweebhodi zakho zesekethe ngokunxulumene nokusetyenziswa kwazo, okanye ukuncedisa kwiinkqubo zokuhlanganisana zamanqanaba amaninzi ukunciphisa abasebenzi kunye nokuphucula ukusebenza kakuhle, i-ANKE PCB iyanikezela. ukuphucula itekhnoloji entsha ukuhlangabezana neemfuno zabathengi ngokuqhubekayo.
Umdibaniso womphetho ubevelling ngomnwe wegolide
I-Edge isinxibelelanisi se-bevelling esetyenziswa ngokubanzi kwiminwe yegolide kwiibhodi ezinegolide okanye iibhodi ze-ENIG, kukusika okanye ukubunjwa kwesidibaniso somphetho kwi-engile ethile.Naziphi na izihlanganisi beveled PCI okanye ezinye kwenza kube lula ukuba ibhodi ukungena isidibanisi.I-Edge Connector bevelling yiparameter kwiinkcukacha zolandelelwano ekufuneka uzikhethe kwaye ujonge olu khetho xa lufunwa.
Ukuprintwa kwekhabhoni
Ikhabhoni eprintiweyo yenziwe nge-ink yekhabhoni kwaye ingasetyenziselwa abafowunelwa bekhibhodi, abafowunelwa beLCD kunye neejumpi.Ushicilelo lwenziwa nge-inki ye-carbon conductive.
Izinto zekhabhoni kufuneka zixhathise i-soldering okanye i-HAL.
I-Insulation okanye ububanzi beCarbon ayinakunciphisa ngaphantsi kwe-75 % yexabiso legama.
Ngamanye amaxesha imaski e peelable iyimfuneko ukukhusela ngokuchasene nokuguquguquka okusetyenzisiweyo.
I-soldermask ekhutshwayo
I-peelable soldermask I-peelable resistant layer isetyenziselwa ukugubungela iindawo ezingasayi kuthengiswa ngexesha lenkqubo ye-solder wave.Lo maleko oguquguqukayo emva koko unokushenxiswa ngokulula ukushiya iipads, imingxunya kunye neendawo ezithengiswayo kwimeko egqibeleleyo yeenkqubo zokuhlanganisana eziziisekondari kunye nokufakwa kwecandelo/isinxibelelanisi.
Iimfama kwaye zingcwatywe
Yintoni Imfama Nge?
Kwindlela engaboniyo, i-via idibanisa umaleko wangaphandle kwelinye okanye ngaphezulu kwamaleko angaphakathi ePCB kwaye inoxanduva loqhakamshelwano phakathi kwaloo maleko aphezulu kunye namaleko angaphakathi.
Ungcwatywa Ngantoni?
Kwindawo engcwatyiweyo, kuphela iileyiti zangaphakathi zebhodi ezidityaniswe yi-via."Ingcwatywe" ngaphakathi kwebhodi kwaye ingabonakali ngaphandle.
Ii-vias eziyimfama nezingcwatywayo ziluncedo ngakumbi kwiibhodi ze-HDI kuba zikhulisa ingxinano yebhodi ngaphandle kokunyuswa kobungakanani bebhodi okanye inani lebhodi ezifunekayo.
Uyenza njani i-vias eyimfama&engcwatywe
Ngokubanzi asisebenzisi i-laser drilling elawulwa nzulu ukwenza ii-vias ezingaboniyo nezingcwatywayo.Okokuqala sigrumba i-core enye okanye ngaphezulu kunye nepleyiti kwimingxuma.Emva koko siyakha kwaye sicinezele isitaki.Le nkqubo inokuphinda iphindwe ngamaxesha amaninzi.
Ithetha ukuba:
1. I-Via isoloko kufuneka inqumle inani elilinganayo leeleya zobhedu.
2. I-Via ayinakuphelela kwicala eliphezulu le-core
3. I-Via ayinakuqala kwicala elisezantsi londoqo
4. Iindlela zokuBopha okanye eziNgcwabayo azinakuqala okanye ziphele ngaphakathi okanye ekupheleni kwenye iMfame/eNgcwaba ngokudlula ngaphandle kokuba enye ivaleleke ngokupheleleyo kwenye (oku kuya kongeza iindleko ezongezelelweyo njengoko kufuneka umjikelo wokushicilela owongezelelweyo).
Ulawulo lwe-impedance
Ulawulo lwe-impedance lube yenye yeenkxalabo ezibalulekileyo kunye neengxaki ezinzulu kuyilo lwe-pcb olunesantya esiphezulu.
Kwizicelo ze-frequency ephezulu, impedance elawulwayo isinceda siqinisekise ukuba iisignali azithotywanga njengoko zijikeleza iPCB.
Ukuchasana kunye nokusabela kwesekethe yombane kunempembelelo enkulu ekusebenzeni, njengoko iinkqubo ezithile kufuneka zigqitywe phambi kwabanye ukuqinisekisa ukusebenza okufanelekileyo.
Ngokusisiseko, i-impedance elawulwayo kukutshatisa iipropathi zemathiriyeli ye-substrate enemilinganiselo yomkhondo kunye neendawo zokuqinisekisa ukuba uthintelo lophawu lomkhondo lungaphakathi kwipesenti ethile yexabiso elithile.
