Imingxuma ivuliwePCBzingahlelwa zibe plated ngokusebenzisa imingxunya (PTH) kwaye non-plated ngokusebenzisa imingxunya (NPTH) ngokusekelwe ukuba ngaba unxibelelwano lombane.
Icwecwe ngomngxuma (PTH) ibhekisa kumngxuma onotyatyambo lwesinyithi kwiindonga zawo, onokufikelela kuqhagamshelo lombane phakathi kweepateni zokuqhuba kumaleko angaphakathi, umaleko wangaphandle, okanye zombini zePCB.Ubungakanani bayo buchongwa ngubukhulu bomngxuma owenziweyo kunye nobukhulu bomgca odibeneyo.
Imingxuma engafakwanga kwimingxuma (NPTH) yimingxuma engathathi nxaxheba kuqhagamshelo lombane lwePCB, eyaziwa ngokuba yimingxuma engeyiyo isinyithi.Ngokomaleko okungena kuwo umngxuma kwi-PCB, imingxuma ingahlelwa njengengqula, ingcwatywe ngendlela/umngxuma, kwaye iyimfama nge/umngxuma.
Ngemingxuma ukungena kuyo yonke iPCB kwaye ingasetyenziselwa uqhagamshelo lwangaphakathi kunye/okanye ukubekwa kunye nokunyuswa kwamalungu.Phakathi kwazo, imingxuma esetyenziselwa ukulungisa kunye / okanye ukudibanisa kombane kunye neeterminals zecandelo (kubandakanywa nezikhonkwane kunye neengcingo) kwi-PCB zibizwa ngokuba yimingxuma yecandelo.Imingxuma ecandiweyo esetyenziselwa ukudityaniswa kweeleya zangaphakathi kodwa ngaphandle kokunyuswa kwecandelo elikhokelela okanye ezinye izinto zokuqinisa zibizwa ngemingxuma.Kukho ubukhulu becala iinjongo ezimbini zokugrumba imingxunya kwi-PCB: enye kukudala intunja ngebhodi, ukuvumela iinkqubo ezilandelayo zenze unxibelelwano lombane phakathi komgangatho ongaphezulu, umaleko ongezantsi, kunye neesekethe zomaleko wangaphakathi webhodi;enye kukugcina imfezeko yolwakhiwo kunye nokuchaneka kwendawo yofakelo lwamacandelo ebhodini.
vias Blind kunye vias wangcwatywa ngokubanzi zisetyenziswa high-uxinaniso interconnect (HDI) ubuchwepheshe of HDI pcb, ikakhulu kumaleko aphezulu iibhodi pcb.I-vias eyimfama idla ngokudibanisa umaleko wokuqala kumaleko wesibini.Kolunye uyilo, i-vias eyimfama inokudibanisa umaleko wokuqala ukuya kumaleko wesithathu.Ngokudibanisa ii-vias ezingaboniyo nezingcwatywayo, uqhagamshelo oluninzi kunye noxinzelelo lwebhodi yesekethe ephezulu efunekayo kwi-HDI inokufezekiswa.Oku kuvumela ukwanda kokuxinana komaleko kwizixhobo ezincinci ngelixa kuphuculwa ukuhanjiswa kwamandla.I-vias efihliweyo inceda ukugcina iibhodi zesekethe zikhaphukhaphu kwaye zihlangene.Ubumfama kunye nokungcwatywa ngoyilo luqhele ukusetyenziswa kuyilo oluntsonkothileyo, ukulinganisa ukukhanya, kunye nexabiso eliphezulu lemveliso yombane efanaii-smartphones, iipilisi, kunyeizixhobo zonyango.
Iindlela ezingaboniyozenziwa ngokulawula ubunzulu bokomba okanye ukukhutshwa kwelaser.Le yokugqibela ngoku yeyona ndlela ixhaphakileyo.Ukupakishwa kwemingxuma kwenziwa ngokulandelana komaleko.Iziphumo ngemingxuma zinokupakishwa okanye zimiswe, zongeza amanyathelo okwenziwa kunye novavanyo olongezelelweyo kunye nokunyusa iindleko.
Ngokwenjongo kunye nomsebenzi wemingxuma, zinokuhlelwa njenge:
Ngemingxuma:
Ziyimingxuma eyenziwe ngesinyithi esetyenziselwa ukufikelela kuqhagamshelo lombane phakathi kweeleya ezahlukeneyo zokuqhuba kwi-PCB, kodwa ingeyiyo injongo yokufakwa kwamalungu.
PS: Via imingxunya zingahlelwa ngakumbi kwi ngokusebenzisa-umngxuma, umngxuma engcwatywe, kunye nomngxuma oyimfama, ngokuxhomekeke umaleko ukuba umngxuma ukungena kwi PCB njengoko kukhankanyiwe ngasentla.
Imingxuma yecandelo:
Zisetyenziselwa i-soldering kunye nokulungisa i-plug-in plug-in components, ngokunjalo nakwimingxuma esetyenziselwa ukudityaniswa kombane phakathi kweeleya ezahlukeneyo zokuqhuba.Imingxuma yecandelo iqhele ukwenziwa ngentsimbi, kwaye ingasebenza njengeendawo zokungena kwizihlanganisi.
Ukufakela imingxunya:
Ziyimingxuma emikhulu kwi-PCB esetyenziselwa ukukhusela i-PCB kwi-casing okanye esinye isakhiwo senkxaso.
Imingxuma yokubeka:
Zenziwa ngokudibanisa ngokuzenzekelayo imingxunya emininzi enye okanye ngokugaya iigrooves kwinkqubo yokomba yomatshini.Ngokuqhelekileyo zisetyenziswa njengeendawo zokuxhoma kwizikhonkwane zokudibanisa, ezifana nezikhonkwane ezimile okwe-oval yesokethi.
Imingxunya yasemva:
Yimingxuma enzulu kancinane egrunjiweyo kwimingxunya ecandiweyo kwi-PCB ukwahlula i-stub kunye nokunciphisa ukubonakaliswa komqondiso ngexesha logqithiso.
Okulandelayo yeminye imingxunya abancedisayo ukuba abavelisi PCB banokusebenzisa kwiInkqubo yokwenziwa kwePCBukuba iinjineli zoyilo zePCB kufuneka ziqhelane nazo:
● Imingxuma yokufumana imingxunya emithathu okanye emine phezulu nasezantsi kwePCB.Eminye imingxuma ebhodini ihambelana nale mingxuma njengendawo yokubhekisela yokubeka izikhonkwane kunye nokulungiswa.Eyaziwa ngokuba yimingxuma ekujoliswe kuyo okanye imingxuma ekujoliswe kuyo, ziveliswa ngomatshini ojoliswe kuwo (umatshini wokubhoboza i-optical punching okanye umatshini wokugrumba i-X-RAY, njl. njl.) phambi kokugaya, kwaye isetyenziselwa ukubeka kunye nokulungisa izikhonkwane.
●Ulungelelwaniso lomaleko wangaphakathiimingxunya yeminye imingxunya kumda webhodi ye-multilayer, esetyenziselwa ukufumanisa ukuba kukho nakuphi na ukutenxa kwibhodi ye-multilayer phambi kokomba ngaphakathi komzobo webhodi.Oku kugqiba ukuba inkqubo yokomba ifuna ukulungiswa.
● Imingxunya yekhowudi luluhlu lwemingxuma emincinci kwelinye icala elisezantsi lebhodi esetyenziselwa ukubonisa ulwazi oluthile lwemveliso, njengemodeli yemveliso, umatshini wokucubungula, ikhowudi yomsebenzisi, njl.
● Imingxuma ye-Fiducial yeminye imingxuma yobukhulu obuhlukeneyo kumda webhodi, esetyenziselwa ukuchonga ukuba i-drill diameter ichanekile ngexesha lenkqubo yokomba.Kule mihla, iifektri ezininzi zisebenzisa obunye ubuchwephesha kule njongo.
● Iithebhu eziqhekezayo ziyimingxuma yokucoca esetyenziselwa ukunqunyulwa kwe-PCB kunye nohlalutyo lokubonisa umgangatho wemingxuma.
● Imingxunya yokuvavanya i-impedance yimingxuma ecwecwe esetyenziselwa ukuvavanya i-impedance ye-PCB.
● Imingxuma yokulindela idla ngokuba yimingxunya engacwangciswanga esetyenziselwa ukunqanda ukuba ibhodi ibekwe ngasemva, kwaye isoloko isetyenziswa ekumiseni ngexesha lokubumba okanye iinkqubo zomfanekiso.
● Imingxuma yezixhobo ngokuqhelekileyo iyimingxuma engacwangciswanga esetyenziselwa iinkqubo ezinxulumeneyo.
● Imingxuma eyi-Rivet yimingxuma engacwangciswanga esetyenziselwa ukulungisa iirivethi phakathi komaleko ngamnye we-core material kunye ne-bonding sheet ngexesha le-multilayer board lamination.Indawo ye-rivet kufuneka igrunjwe ngexesha lokomba ukukhusela amaqamza ukuba angahlali kuloo ndawo, nto leyo enokubangela ukuqhekeka kwebhodi kwiinkqubo zamva.
Ibhalwe ngu-ANKE PCB
Ixesha lokuposa: Jun-15-2023
