Ukufezekisa uyilo olululo lwePCB, ukongeza kubume bendlela iyonke, imithetho yobubanzi bomgca kunye nesithuba nayo ibalulekile.Kungenxa yokuba ububanzi bomgca kunye nesithuba simisela ukusebenza kunye nokuzinza kwebhodi yesekethe.Ke ngoko, eli nqaku liza kubonelela ngentshayelelo eneenkcukacha kwimithetho yoyilo ngokubanzi yobubanzi bomgca wePCB kunye nesithuba.
Kubalulekile ukuqaphela ukuba useto olungagqibekanga lwesoftware kufuneka luqwalaselwe ngokufanelekileyo kwaye Uqwalaselo loMthetho woYilo (DRC) kufuneka luvulwe phambi komzila.Kunconywa ukusebenzisa igridi ye-5mil yomzila, kunye nobude obulinganayo igridi ye-1mil inokusetwa ngokusekelwe kwimeko.
Imithetho Yobubanzi Bomgca wePCB:
1.Umzila kufuneka kuqala uhlangabezane nesakhono sokwenza umzi-mveliso.Qinisekisa umenzi wemveliso kunye nomthengi kwaye unqume amandla abo okuvelisa.Ukuba akukho mfuno zikhethekileyo zinikezelwa ngumthengi, bhekisa kwiitemplates zoyilo lwe-impedance kububanzi bomgca.
I-2.Impedans templates: Ngokusekelwe kubukhulu bebhodi enikeziweyo kunye neemfuno zomaleko kumthengi, khetha imodeli efanelekileyo ye-impedance.Cwangcisa ububanzi bomgca ngokobubanzi obalwayo ngaphakathi kwemodeli ye-impedance.Amaxabiso aqhelekileyo okuthintela aquka i-50Ω enesiphelo esinye, umahluko 90Ω, 100Ω, njalo njalo. Qaphela ukuba isignali ye-eriyali ye-50Ω kufuneka ithathele ingqalelo ireferensi kumaleko akufutshane.Kumaleko axhaphakileyo e-PCB njengereferensi engezantsi.
3.Njengoko kuboniswe kumzobo ongezantsi, ububanzi bomgca kufuneka buhlangabezane neemfuno zamandla okusebenza ngoku.Ngokuqhelekileyo, ngokusekelwe kumava kunye nokuqwalasela imida yomzila, idizayini yobubanzi bomgca wamandla inokumiselwa ngezi zikhokelo zilandelayo: Ukunyuka kweqondo lokushisa kwe-10 ° C, kunye nobukhulu be-copper ye-1oz, ububanzi bomgca we-20mil bunokusingatha i-overload current ye-1A;kwi-0.5oz ubukhulu bobhedu, ububanzi bomgca we-40mil bunokusingatha i-overload current ye-1A.
4. Ngeenjongo zoyilo ngokubanzi, ububanzi bomgca kufuneka kukhethwa ukuba kulawulwe ngaphezu kwe-4mil, enokuthi ihlangabezane nesakhono sokwenza uninzi lwabavelisi bePCB.Kuyilo apho ulawulo lwe-impedance lungafunekiyo (ubukhulu becala iibhodi ezi-2), ukuyila ububanzi bomgca ngaphezu kwe-8mil kunokuncedisa ukunciphisa iindleko zokwenziwa kwe-PCB.
5. Qwalasela ukusetwa kobunzima bobhedu kuluhlu oluhambelanayo kwindlela yokuhambisa.Thatha i-2oz yobhedu umzekelo, zama ukuyila ububanzi bomgca ngaphezulu kwe-6mil.Ukuqina kobhedu, kokukhona ububanzi bomgca.Buza iimfuno zokwenziwa komzi-mveliso woyilo olungelulo oluqhelekileyo lobhedu.
6. Uyilo lwe-BGA kunye ne-0.5mm kunye ne-0.65mm pitches, ububanzi bomgca we-3.5mil bunokusetyenziswa kwiindawo ezithile (zinokulawulwa yimithetho yoyilo).
7. Uyilo lwebhodi ye-HDI inokusebenzisa ububanzi bomgca we-3mil.Uyilo olunobubanzi bomgca ngaphantsi kwe-3mil, kuyimfuneko ukuqinisekisa ukubanakho ukuveliswa kwefektri kunye nomthengi, njengoko abanye abavelisi banakho kuphela i-2mil ububanzi bemigca (inokulawulwa yimithetho yoyilo).Ububanzi bomgca obuncinci bonyusa iindleko zokuvelisa kunye nokwandisa umjikelo wemveliso.
8. Iimpawu ze-analog (ezifana nesandi kunye neempawu zevidiyo) kufuneka ziyilwe ngemigca engqindilili, ngokuqhelekileyo malunga ne-15mil.Ukuba indawo ilinganiselwe, ububanzi bomgca kufuneka bulawuleke ngaphezu kwe-8mil.
9. Iimpawu zeRF kufuneka ziphathwe ngemigca engqindilili, ngokubhekiselele kumaleko akufutshane kunye nokuphazamiseka okulawulwa kwi-50Ω.Iimpawu zeRF kufuneka ziqwalaselwe kumaleko angaphandle, kuthintelwe iileya zangaphakathi kwaye kuncitshiswe ukusetyenziswa kwe-vias okanye utshintsho lomaleko.Iimpawu zeRF kufuneka zijikelezwe yinqwelomoya ephantsi, kunye nomgangatho wereferensi kukhethwa ukuba ibe lubhedu lwe-GND.
PCB Wiring Line IMithetho yeSithuba
1. I-wiring kufuneka kuqala ihlangabezane nomthamo wokucubungula wefektri, kwaye isithuba somgca kufuneka sihlangabezane nekhono lokuvelisa lomzi-mveliso, olawulwa ngokubanzi kwi-4 mil okanye ngaphezulu.Kuyilo lwe-BGA kunye ne-0.5mm okanye i-0.65mm isithuba, isithuba somgca we-3.5 mil singasetyenziswa kwezinye iindawo.Uyilo lwe-HDI lunokukhetha isithuba somgca we-3 mil.Uyilo olungaphantsi kwe-3 mil kufuneka luqinisekise isakhono semveliso yefektri yokuvelisa kunye nomthengi.Abanye abavelisi banamandla okuvelisa i-2 mil (elawulwa kwiindawo ezithile zokuyila).
2. Ngaphambi kokuyila umgaqo wokushiya umgca, qwalasela imfuno yobunzima bobhedu yoyilo.Kwi-1 ounce yobhedu zama ukugcina umgama we-4 mil okanye ngaphezulu, kunye ne-2 ounce yobhedu, zama ukugcina umgama we-6 mil okanye ngaphezulu.
3. Uyilo lomgama wezibini zesignali ezahlukeneyo kufuneka zibekwe ngokweemfuno ze-impedance ukuqinisekisa isithuba esifanelekileyo.
4. I-wiring kufuneka igcinwe kude nesakhelo sebhodi kwaye uzame ukuqinisekisa ukuba isakhelo sebhodi sinokuba nomhlaba (GND) vias.Gcina umgama phakathi kweempawu kunye nemiphetho yebhodi ngaphezu kwe-40 mil.
5. Isignali yomgca wamandla kufuneka ibe nomgama ubuncinane we-10 mil ukusuka kwi-GND layer.Umgama phakathi kwamandla kunye neenqwelo zethusi zamandla kufuneka zibe ubuncinane ubuncinane be-10 mil.Kwezinye ii-ICs (ezifana ne-BGAs) ezinezithuba ezincinci, umgama ungalungiswa ngokufanelekileyo ubuncinane be-6 mil (ukulawulwa kwiindawo ezithile zoyilo).
6.Izibonakaliso ezibalulekileyo ezifana newashi, ukuhlukana, kunye neempawu ze-analog kufuneka zibe nomgama ophindwe kathathu ububanzi (3W) okanye zijikelezwe ziinqwelomoya zomhlaba (GND).Umgama phakathi kwemigca kufuneka ugcinwe ngamaxesha angama-3 ububanzi bomgca ukunciphisa i-crosstalk.Ukuba umgama phakathi kwamaziko emigca emibini awukho ngaphantsi kwamaxesha ama-3 ububanzi bomgca, unokugcina i-70% yendawo yombane phakathi kwemigca ngaphandle kokuphazamiseka, eyaziwa ngokuba ngumgaqo we-3W.
7.Imiqondiso yomaleko okufutshane kufuneka iphephe i-wiring ehambelanayo.Isalathiso sendlela kufuneka senze i-orthogonal structure ukunciphisa okungafunekiyo interlayer crosstalk.
8. Xa uhambisa umgca phezu komgangatho, gcina umgama ubuncinane we-1mm ukusuka kwimingxuma yokunyuka ukukhusela iisekethe ezimfutshane okanye ukukrazula komgca ngenxa yoxinzelelo lofakelo.Indawo ejikeleze imingxuma yezikrufu kufuneka igcinwe icacile.
9. Xa uhlula iileyile zamandla, kuphephe ukuhlukana okugqithisileyo.Kwindiza yamandla enye, zama ukuba ungabi nemiqondiso yamandla angaphezu kwama-5, ngokukhethekileyo phakathi kweempawu zamandla ezi-3, ukuqinisekisa umthamo wangoku wokuthwala kwaye ugweme umngcipheko wokuwela umqondiso wokuwela indiza eyahlulayo yeeleyile ezikufutshane.
I-10.Izahlulo zendiza zamandla kufuneka zigcinwe rhoqo ngokusemandleni, ngaphandle kokwahlula okude okanye okwe-dumbbell, ukuphepha iimeko apho iziphelo zikhulu kwaye umbindi uncinci.Umthamo wangoku wokuthwala kufuneka ubalwe ngokusekelwe kububanzi obuncinci bendiza yobhedu yamandla.
Shenzhen ANKE PCB Co.,LTD
2023-9-16
Ixesha lokuposa: Sep-19-2023
