Yintoni ukupakisha?
Ukupakishwa kubhekisa kulungiselelo lweeleya zobhedu kunye neeleya zokugquma ezenza iPCB phambi koyilo loyilo lwebhodi.Ngelixa i-stack-up-up ivumela ukuba ufumane ukujikeleza okungaphezulu kwibhodi enye ngokusebenzisa iileya ezahlukeneyo zebhodi yePCB, ubume boyilo lwe-PCB yokupakisha lunika ezinye izibonelelo ezininzi:
• Isitaki se-PCB somaleko sinokukunceda unciphise ukuba sesichengeni sesekethe yakho kwingxolo yangaphandle kunye nokunciphisa i-radiation kunye nokunciphisa i-impedance kunye neenkxalabo ze-crosstalk kwi-high-speed PCB uyilo.
• Umaleko olungileyo wokupakishwa kwePCB usenokukunceda ukuba ulungelelanise iimfuno zakho zexabiso eliphantsi, iindlela zokuvelisa ezisebenzayo kunye neenkxalabo malunga nemiba yemfezeko yomqondiso.
• Isitaki se-PCB esifanelekileyo sinokuphucula ukuhambelana kwe-Electromagnetic yoyilo lwakho ngokunjalo.
Kuya kuba luncedo kakhulu ukuba ulandele uqwalaselo lwePCB eprintiweyo kwibhodi yakho yesekethe eprintiweyo.
Kwii-PCB ezininzi, iileya ngokubanzi ziquka inqwelomoya ephantsi (inqwelomoya ye-GND), inqwelomoya yamandla (indiza ye-PWR), kunye neengqimba zesignali zangaphakathi.Nantsi isampuli ye-8-layer PCB eqokelelweyo.
ANKE PCB ibonelela multilayer / iibhodi zeesekethe umaleko eliphezulu kuluhlu ukusuka 4 ukuya 32 umaleko, ubukhulu ibhodi ukusuka 0.2mm ukuya 6.0mm, ubukhulu ubhedu ukusuka 18μm ukuya 210μm (0.5oz ukuya 6oz), umaleko wangaphakathi ubhedu ubukhulu ukusuka 18μm ukuya 70μm (0.5) oz ukuya kwi-2oz), kunye nesithuba esincinci phakathi kweeleya ukuya kwi-3mil.
Ixesha lokuposa: Sep-05-2022
