I-18 ye-HDIE ye-HDI ye-telecom ene-oda ye-copper ekhethekileyo

Intshayelelo

I-HDI sisifinyezo sokunxibelelana okuphezulu. Yindlela yokuyila i-PCB ye-PCB. Itekhnoloji ye-HDI ye-HDI inokuncitshiswa kweebhodi zesekethe eziprintiweyo kwicandelo lePCB. Itekhnoloji ikwabonelela ngentsebenzo ephezulu kunye nokuxinana okukhulu kweengcingo kunye nesekethe.

Ngendlela, iibhodi zesekethe ze-HDI zenzelwe ngokwahlukileyo kwiibhodi zesekethe eziprintwayo.

I-HDI PCBS ixhotyiswe yi-vias amancinci, imigca kunye nezithuba. I-HDI PCBS iphosakele kakhulu, ehambelana kakhulu nomlinganiso wabo.

Kwelinye icala, i-HDI ibonakaliswa ngokufuduswa okuphezulu, i-radiation engafunekiyo, kunye nokuhlawulwa kwe-PCB. Ngenxa yokulinganisa kweBhodi, iBhodi yoxinaniso iphezulu.

I-microvias, imfama yangaboni kwaye yangcwatywa i-Vias, ukusebenza okuphezulu, izixhobo ezincinci kunye nemigca emnandi zonke iibhodi zesekethe ze-HDI ziprintiweyo.

Iinjineli kufuneka zibe nokuqonda okucokisekileyo kwenkqubo yoyilo kunye ne-HDI PCB. I-Microchips kwi-Microchips kwiBhodi yeSekethe ye-HDI ifuna ingqalelo ekhethekileyo kuyo yonke inkqubo yendibano, kunye nezakhono ezingekho mthethweni.

Kwiyilo le-computer njenge-leetops, iifowuni zeselula, i-HDI PCB zincinci ngokobukhulu kunye nobunzima. Ngenxa yobungakanani babo obuncinci, i-PCB ye-HDI nayo iphantsi kwe-rocks.

I-HDI VIAS 

I-VIAS yimingxunya kwi-PCB esetyenziselwa ukudibanisa ngombane kwi-PCB. Sebenzisa iindawo ezininzi kwaye ukudibanisa kunye ne-VIAS kunciphisa ubungakanani be-PCB. Kuba eyona njongo iphambili yeBhodi ye-HDI kukunciphisa ubungakanani bayo, iVias yenye yezona zinto zibalulekileyo. Kukho iintlobo ezahlukeneyo zezibonda.

THlela umngxunya

Ihamba kuyo yonke i-PCB, ukusuka kwi-fayer engaphezulu kungqimba ezantsi, kwaye ibizwa ngokuba yiVia. Okwangoku, baqhagamshela zonke iindawo zeBhodi yeSiphaluka eprintiweyo. Nangona kunjalo, uVias uthatha indawo engaphezulu kwaye unciphise indawo yecandelo.

Ukungaboninge

I-VIA eyimfama uVias icacisa nje umaleko wangaphandle ukuya kwi-Inner ye-Inner ye-PCB. Akukho sidingo sokukhwela yonke i-PCB iphela.

Ingcwatywe nge

I-VIAS RIASS isetyenziselwa ukudibanisa uluhlu lwangaphakathi lwe-PCB. UVias uVias akabonakali ngaphandle kwePCB.

Micronge

I-Vias Micro viis yeyona incinci ye-DITS engaphantsi kwe-6 mils. Kuya kufuneka usebenzise i-laser ye-pislling ukwenza i-vias ezincinci. Ke ngokusisiseko, i-microvias isetyenziselwa iibhodi ze-HDI. Oku kungenxa yobukhulu bayo. Kuba ufuna icandelo uxinzelelo kwaye awunakuchitha indawo kwi-HDI PCB, kububulumko ukutshintsha ezinye i-vias enye enee-microvias. Ukongeza, i-microvias ayinabungozi kwimiba yokwandisa i-thermal (CTE) ngenxa yemingxunya yabo emifutshane.

Iminxekile

I-HDI PCB ye-HICB ingumbutho we-Worting. Inani leendawo okanye izitavu zinokumiselwa njengoko kufuneka. Nangona kunjalo, oku kunokuba yi-8 zokubala ukuya kwi-40 yamangcwabo okanye ngaphezulu.

Kodwa inani elichanekileyo leendawo lixhomekeke kubuninzi bendawo. I-Multilayer Staking inokukunceda ukuba unciphise ubungakanani be-PCBB. Ikwanciphisa iindleko zokwenza izinto.

Ngendlela, ukumisela inani leendawo kwi-HDI PCB, kuya kufuneka ubone ubungakanani bomkhondo kunye neminatha kwingqimba nganye. Emva kokuchonga, ungabala i-stang tick ifunwa kwiBhodi yakho ye-HDI yakho.

Iingcebiso zokuyila i-HDI PCB

1. Ukuchongwa kwecandelo. Iibhodi ze-HDI zifuna ukubala i-SMDS kunye ne-BGAS incinci kune-0.65mm. Kufuneka ukhethe ngobulumko njengoko zichaphazela uhlobo lwe-TOE, trace ububanzi kunye ne-HDI PCB STAck-up.

2. Kufuneka usebenzise i-microvias kwiBhodi ye-HDI. Oku kuyakuvumela ukuba ufumane kabini indawo ephindwe kabini ye-hia okanye enye.

I-3. Izixhobo ezisebenzayo nezisebenzayo kufuneka zisetyenziswe. Kubalulekile ukuvelisa imveliso.

4. Ukufumana umphezulu we-pcb ye-pcb, kuya kufuneka ugcwalise imingxunya.

5. Zama ukukhetha izixhobo kunye nexabiso le-CTE efanayo kuzo zonke iindawo.

6. Hlawula ingqalelo yolawulo lobushushu. Qiniseka ukuba uyila ngokufanelekileyo kwaye ulungelelanise iindawo ezinokuthi zinciphise ngokufanelekileyo ubushushu.