Iimveliso
I-18 layer HDI ye-telecom enocwangco olukhethekileyo lobhedu
| Iileya | 18 iileya |
| Ubukhulu bebhodi | 1.58MM |
| Izinto eziphathekayo | FR4 tg170 |
| Ubunzima bobhedu | 0.5/1/1/0.5/ 0.5/1/1/0.5/0.5/1/1/0.5oz |
| Umphezulu Gqiba | ENIG Au Ukutyeba0.05um;Ni Ukutyeba 3um |
| Umngxuma omncinci(mm) | 0.203mm |
| Ububanzi bomgca omncinci(mm) | 0.1mm/4mil |
| Isithuba somgca omncinci(mm) | 0.1mm/4mil |
| Solder Mask | Luhlaza |
| Umbala wentsomi | Mhlophe |
| Ukulungiswa koomatshini | V-amanqaku, CNC Milling(umzila) |
| Ukupakisha | Ingxowa ye-Anti-static |
| Uvavanyo lwe-E | Flying probe okanye Fixture |
| Umgangatho wokwamkelwa | IPC-A-600H Udidi 2 |
| Isicelo | Iimoto ze-elektroniki |
Intshayelelo
I-HDI sisishunqulelo se-High-Density Interconnect.Bubuchule boyilo oluntsonkothileyo lwePCB.Iteknoloji ye-HDI PCB inokunciphisa iibhodi zesekethe eziprintiweyo kwintsimi ye-PCB.Itekhnoloji ikwabonelela ngokusebenza okuphezulu kunye nokuxinana okukhulu kweengcingo kunye neesekethe.
Ngendlela, iibhodi zeesekethe ze-HDI zenzelwe ngokuhlukileyo kuneebhodi zesekethe eziprintiweyo eziqhelekileyo.
IiPCB zeHDI zinikwe amandla zii-vias ezincinci, imigca kunye nezithuba.IiPCB zeHDI zikhaphukhaphu kakhulu, ezinxibelelene ngokusondeleyo neminiaturization yazo.
Kwelinye icala, i-HDI iphawulwa ngokusasazwa kwamaza amaninzi, imitha elawulwayo engafunekiyo, kunye nokuphazamiseka okulawulwayo kwi-PCB.Ngenxa ye-miniaturization yebhodi, ukuxinana kwebhodi kuphezulu.
I-Microvias, ii-vias ezingaboniyo kunye nokungcwatywa, ukusebenza okuphezulu, izixhobo ezibhityileyo kunye nemigca emihle zizo zonke iimpawu zebhodi zesekethe eziprintiweyo ze-HDI.
Iinjineli kufuneka zibe nokuqonda ngokucokisekileyo kuyilo kunye nenkqubo yokwenziwa kwe-HDI PCB.I-Microchips kwiibhodi zesekethe eziprintiweyo ze-HDI zifuna ingqalelo ekhethekileyo kuyo yonke inkqubo yendibano, kunye nezakhono ezibalaseleyo zokuthambisa.
Kuyilo oludityanisiweyo olufana neelaptops, iiselfowuni, iiPCB zeHDI zincinci ngobungakanani kunye nobunzima.Ngenxa yobukhulu bazo obuncinci, ii-HDI PCBs nazo azichanekanga kukuqhekeka.
HDI Vias
I-Vias yimingxuma kwi-PCB esetyenziselwa ukudibanisa ngombane iileya ezahlukeneyo kwi-PCB.Ukusebenzisa iileya ezininzi kunye nokuzidibanisa nge-vias kunciphisa ubungakanani bePCB.Ekubeni injongo ephambili yebhodi ye-HDI kukunciphisa ubungakanani bayo, i-vias yenye yezona zinto zibalulekileyo.Kukho iintlobo ngeentlobo zemingxunya.
Tngomngxuma odlulayo
Idlula kuyo yonke i-PCB, ukusuka kumphezulu ukuya kumaleko asezantsi, kwaye ibizwa ngokuba yi-via.Ngeli xesha, badibanisa zonke iileyile zebhodi yesekethe eprintiweyo.Nangona kunjalo, i-vias ithatha indawo eninzi kwaye inciphisa indawo yecandelo.
Ukungaboninge
I-Vis eyimfama idibanisa nje umaleko wangaphandle kumaleko angaphakathi we-PCB.Akukho mfuneko yokwemba iPCB yonke.
Ungcwatywe nge
Ii-vias ezingcwatywayo zisetyenziselwa ukudibanisa iileya zangaphakathi zePCB.Ii-vias ezingcwatywayo azibonakali ukusuka ngaphandle kwePCB.
Micronge
I-Micro vias zezona zincinci ngesayizi engaphantsi kwe-6 ms.Kufuneka usebenzise i-laser drilling ukwenza i-micro vias.Ke ngokusisiseko, ii-microvias zisetyenziselwa iibhodi ze-HDI.Oku kungenxa yobukhulu bayo.Kuba ufuna ingxinano yecandelo kwaye awukwazi ukuchitha indawo kwi-HDI PCB, kububulumko ukubuyisela ezinye ii-vias eziqhelekileyo kunye ne-microvias.Ukongeza, ii-microvias azikhathazwa yimicimbi yokwanda kwe-thermal (CTE) ngenxa yemibhobho emifutshane.
Iminxekile
HDI PCB stack-up ngumbutho umaleko-by-umaleko.Inani leeleya okanye imfumba inokumiselwa njengoko kufuneka.Nangona kunjalo, oku kunokuba ngamaleko asi-8 ukuya kumaleya angama-40 okanye ngaphezulu.
Kodwa inani elichanekileyo leeleya lixhomekeke kubuninzi beetrayisi.Ukupakishwa kwe-Multilayer kunokukunceda ukunciphisa ubungakanani bePCB.Kwakhona kunciphisa iindleko zokuvelisa.
Ngendlela, ukumisela inani leeleya kwi-HDI PCB, kufuneka uqikelele ubungakanani bomkhondo kunye nenetha kumaleko ngamnye.Emva kokuba zichonge, ungabala ugcino olufunekayo kwibhodi yakho ye-HDI.
Iingcebiso ukuyila HDI PCB
1. Ukhetho oluchanekileyo lwecandelo.Iibhodi ze-HDI zifuna i-pin count ephezulu ye-SMD kunye ne-BGAs encinci kune-0.65mm.Kufuneka uzikhethe ngobulumko njengoko zichaphazela ngohlobo, ukulandelela ububanzi kunye ne-HDI PCB stack-up.
2. Kufuneka usebenzise i-microvias kwibhodi ye-HDI.Oku kuya kukuvumela ukuba ufumane kabini indawo ye-via okanye enye.
3. Izincedisi ezisebenzayo nezisebenzayo mazisetyenziswe.Kubaluleke kakhulu ukuveliswa kwemveliso.
4. Ukufumana umphezulu we-PCB othe tyaba, kufuneka ugcwalise ngemingxuma.
5. Zama ukukhetha izinto ezinomlinganiselo ofanayo we-CTE kuzo zonke iileya.
6. Nika ingqalelo kulawulo lwe-thermal.Qinisekisa ukuba uyila ngokufanelekileyo kwaye ulungelelanise iileya ezinokukhupha ngokufanelekileyo ubushushu obugqithisileyo.
